Samsung’s $7.2B Bet on US Chip Packaging to Rival TSMC and SK Hynix
Samsung’s going big in the US with a $7.2B chip packaging facility on top of $37B already planned for manufacturing. Targeting 2nm and 4nm tech, they’re eyeing big clients like Apple and Tesla while aiming to beat TSMC and SK Hynix with a full chip-to-memory solution. Taylor Fab 1 in Texas is almost ready, with equipment coming in 2026.