ProcessorsSamsung Samsung’s $7.2B Bet on US Chip Packaging to Rival TSMC and SK Hynix by ytools August 12, 2025 August 12, 2025 Samsung’s going big in the US with a $7.2B chip packaging facility on top of $37B already planned for manufacturing. Targeting 2nm and 4nm tech, they’re eyeing big clients like … Read more 0 FacebookTwitterWhatsappTelegram