DFI’s newly published industrial motherboard roadmap has revealed Intel’s next waves of processors coming to embedded computing. 
The documents outline upcoming support for Nova Lake, Panther Lake, Bartlett Lake, Twin Lake, and Wildcat Lake CPUs, mapping out the company’s strategy through 2026.
Panther Lake will first target consumer laptops this year, but DFI plans to integrate the chips into its high-performance and compact modules as well. The 28W PTH9HA variant is scheduled for late 2025 in HPC and COMe systems, while the lower-power 15W Panther Lake U (PTH9HM) is set for 2026. Basic and compact Panther Lake modules with 45W TDP are expected in early 2026.
Nova Lake, Intel’s next-generation desktop and mobile line, appears in DFI’s SBC roadmap for small-form x86 motherboards. Both Nova Lake-H (performance) and Nova Lake-U (ultra-low power) chips are slated for the second half of 2026.
Bartlett Lake is further along in development. The S-series is already undergoing BIOS updates and is expected to launch at the end of this year. A 12P follow-up series is due next year, also in its BIOS update phase.
Twin Lake will focus on compact SBCs in 2.5″ and 1.8″ x86 designs, with support for up to 8 cores. Early 2025 is the projected timeline, with the chips appearing in the ASL/TWL051 SBC, paired alongside Amston Lake CPUs. However, development of the 2.5″ Twin Lake SBC is still ongoing.
Wildcat Lake-U is positioned as Twin Lake’s successor. With a 15W TDP, it is planned for 2.5″ SBCs in early 2026, closing out Intel’s embedded CPU roadmap for this cycle.
Together, these updates highlight how Intel’s Lake series is shaping the next generation of industrial and embedded computing, with overlapping rollouts ensuring a steady stream of performance and efficiency improvements from 2025 through 2026.