Intel and Samsung Could Join Forces on Glass Substrate Packaging

Intel’s packaging business, particularly its glass substrate technology, may get a much-needed lifeline from an unlikely partner – Samsung. According to reports from the Korean press, Samsung chairman Lee Jae-Yong’s visit to the US has sparked speculation that the tech giant could inject capital into Intel’s advanced packaging division.

This comes shortly after Intel’s stock enjoyed a boost when the US government confirmed a 10% stake in the company.

At the core of the speculation is Intel’s strength in advanced back-end chip manufacturing, especially hybrid bonding packaging. These technologies are crucial for artificial intelligence hardware, where GPUs and accelerators require precise and power-hungry packaging to function efficiently. TSMC currently dominates this space, investing heavily in packaging to meet soaring AI demand. But Intel, despite its recent struggles, is one of the only other players capable of delivering at scale. That’s where Samsung sees an opportunity.

Samsung lags behind TSMC in cutting-edge chip manufacturing, with industry watchers pointing to inconsistent yields and shipment challenges. Teaming up with Intel could help both firms. Intel gains fresh capital and manufacturing support while Samsung secures access to Intel’s packaging know-how. Some insiders believe this could even lead to a joint venture or equity investment, echoing moves by Softbank and the US government.

Intel’s glass substrate technology is a key part of the story. Although reports suggest Intel has quietly scaled back investment in this area, the company continues licensing the tech to raise revenue. A former Intel glass substrate executive joining Samsung only fuels rumors that the two could collaborate directly on advancing the technology.

If true, the partnership would strengthen Intel’s ability to keep pace with TSMC while giving Samsung a chance to close its gap in contract chip manufacturing. Both firms stand to gain leverage in the global semiconductor battle, where AI demand is rewriting the rules of competition.