In a surprising twist, Google’s Tensor G5 chip is reportedly being manufactured using TSMC’s latest 3nm ‘N3P’ technology, making it the first to use the third-generation 3nm process, according to new leaks. This is a significant step ahead of Apple’s expected use of the ‘N3E’ process, which is a second-generation 3nm node. 
While many details surrounding the Tensor G5 are still unclear, the chip is expected to offer a substantial performance boost, with improvements to its Tensor Processing Unit (TPU) and CPU.
The Tensor G5, designed specifically for Google’s Pixel devices, is rumored to feature a more powerful TPU, offering up to 60% better performance, alongside a 34% increase in CPU speeds. These enhancements aim to make the Pixel more responsive in everyday tasks such as web browsing and running the latest AI features. However, Google has been discreet about the specifics of the chip’s manufacturing process, only noting that the Tensor G5 is built using a ‘leading 3nm process node.’ Despite not mentioning ‘N3P’ specifically, this could indicate that Google is using TSMC’s most advanced technology.
TSMC’s N3P process offers a 5% performance boost over the previous N3E node while maintaining the same power consumption, or alternatively, it can deliver up to a 10% improvement in energy efficiency at the same frequency. This technology not only promises better performance but also improved battery life and reduced overheating, a welcome advancement for users of mobile devices. Despite this, Google has yet to officially confirm these details, leaving room for skepticism.
As we approach the launch of the Pixel 10 series, more information will likely surface, but for now, it’s clear that Google is making significant strides with the Tensor G5, potentially outpacing its rivals in terms of the chip’s manufacturing process.