After months of speculation, supply setbacks, and technical hurdles, Samsung has reportedly secured a major win in the high-bandwidth memory race by supplying 12-Hi HBM3E stacks to NVIDIA. 
This move places the Korean tech giant directly alongside SK hynix and Micron in Team Green’s supply chain, signaling a significant comeback in a market where Samsung had previously struggled.
Samsung’s HBM journey hasn’t been smooth. Early HBM3 plans for NVIDIA reportedly fell through due to thermal performance issues, forcing the company to pivot to its improved HBM3E. According to Korean media reports, Samsung will now be delivering between 30,000 and 50,000 units of these 12-layer HBM3E modules, likely destined for NVIDIA’s upcoming Blackwell Ultra products.
Industry chatter suggests Samsung’s aggressive pricing strategy may have tipped the scales. A recent report hinted at potential price cuts for HBM3E, making it hard for rivals to compete without slashing their own margins. Given NVIDIA’s appetite for maximizing profitability, Samsung’s offer may have been too good to refuse.
Samsung also holds a key strategic edge – unlike some competitors, it operates its own semiconductor and logic production lines, allowing greater flexibility and speed in scaling up HBM output. The company is already pushing forward with HBM4 development, aiming to stay ahead in the next phase of high-performance memory technology.
While Samsung has yet to officially confirm the NVIDIA deal, it hinted at strong HBM progress in its Q2 earnings call. If the reports are accurate, this supply agreement could mark a pivotal moment in Samsung’s efforts to reclaim lost DRAM market share and position itself as a dominant force in the HBM sector once again.