Samsung is gearing up for a massive push in the U.S. 
semiconductor market, with plans to invest over $7.2 billion in a new advanced chip packaging facility. This fresh injection comes on top of its already staggering $37 billion commitment to chip manufacturing in the States, signaling a full comeback strategy after recent struggles in its semiconductor business.
The move is expected to be announced during the upcoming South Korea–USA summit on August 25. Industry chatter suggests Samsung aims to produce cutting-edge 2nm and 4nm chips, potentially securing high-profile clients like Apple and Tesla, while also sidestepping tariff risks from past U.S. trade policies.
Originally, Samsung had a $44 billion plan that included a chip packaging plant, but it was scrapped due to low demand. Now, with market needs surging, the packaging facility is back on the table, giving Samsung a competitive edge. Unlike rivals, Samsung offers an all-in-one semiconductor solution-chip manufacturing, advanced packaging, and memory chip production. TSMC handles manufacturing and packaging, while SK Hynix focuses solely on memory.
Meanwhile, Samsung’s Taylor Fab 1 in Texas is nearing completion, with construction expected to finish by the end of the year. Equipment installation will follow in 2026, paving the way for full-scale operations.